Chitosan-reinforced blended photopolymers for DLP: Mechanical enhancement and anisotropic shrinkage behavior
Penulis/Author
Dinny Harnany, S.T., M. Sc. (1); Prof. Ir. Jamasri, Ph.D., IPU., ASEAN Eng. (2); DEYTA EAVAN SUKAMTA (3); ABDJAD AIMAN SABILLA (4); DAFAA SAPUTRA (5); Ho Cheng How (6); Ir. Muhammad Akhsin Muflikhun, S.T., MSME., Ph.D (7)
Tanggal/Date
2026
Kata Kunci/Keyword
Abstrak/Abstract
Digital Light Processing (DLP) offers high resolution and expedited production in additive manufacturing;
nevertheless, the fragility and dimensional inaccuracy of photopolymer resins persist in posing significant
constraints. This study investigates the impact of incorporating chitosan (0–10 wt%) into a blended photo
polymer system composed of standard resin (epoxy-diacrylate based) and flexible resin (methacrylate-based).
Mechanical characterization was conducted using tensile, flexural, impact and hardness testing, supplemented by
Fourier-transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM) and assessment of
dimensional shrinkage. The results of this study demonstrated uniform enhancements in tensile strength, flexural
strength, and hardness as the content of chitosan increased. In contrast, impact energy specific exhibited a
decline at low concentrations (2–4 wt%), followed by a recovery phase at 6–8 wt%, and a substantial surge at
10 wt%, reaching approximately two times the value of the pure blended resin. The SEM and FTIR investigations
validated the interfacial interactions and dispersion processes aligned with these mechanical patterns. Dimen
sional assessment revealed contraction along the X and Y axes; however, an unforeseen expansion transpired in
the Z-axis, which was attributed to overcuring. The findings indicate that the chitosan enhances mechanical
characteristics and causes anisotropic dimensional responses in DLP printing. These insights offer essential di
rection for enhancing filler content and processing conditions to produce more robust and dependable photo
polymer composites for additive manufacturing applications
